Utilization of die active surfaces for laterally extending die internal and external connections

ABSTRACT

The formation of routing traces on an external surface of a semiconductor device, such as a flip-chip, which has a plurality of ball or bump sites patterned in specific locations, wherein the ball or bump sites are in electrical communication with external communication traces which are used to route signals from the flip-chip integrated circuitry. Such external communication traces generally result in unused space on the exterior surface of the flip-chip. This unused space can be utilized for forming routing traces to connect portions of the internal circuitry of the flip-chip rather than forming such routing traces internally, for forming routing traces to connect two or more semiconductor dice, or for forming routing traces for use as repair mechanisms.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of application Ser. No. 09/599,752,filed Jun. 22, 2000, now U.S. Pat. No. 6,331,736 B1, issued Dec. 18,2001, which is a continuation of application Ser. No. 09/287,456, filedApr. 7, 1999, now U.S. Pat. No. 6,124,195, issued Sep. 26, 2000, whichis a divisional of application Ser. No. 09/229,373, filed Jan. 13, 1999,now U.S. Pat. No. 6,078,100, issued Jun. 20, 2000.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to trace formation in the fabrication ofsemiconductor devices. More particularly, the present invention relatesto the formation of routing traces on an external surface of asemiconductor device.

2. State of the Art

Integrated circuit (“IC”) devices generally consist of a plurality ofcomponents (such as resistors, capacitors, diodes, transistors, fuses,conductors, and the like) fabricated on a single semiconductor chip.Each of these components is electrically isolated from one another bydielectric materials. Thus, in order to interact with one another toform an integrated circuit, a plurality conductive interconnections(hereinafter “traces”) must be formed between the components.

FIG. 10 illustrates an exemplary trace configuration connecting a pairof pinch resistors 202A and 202B in series in an IC device. First andsecond pinch resistors 202A and 202B, respectively, are formed in ap-type substrate 206 by doping n-type regions 208A and 208B,respectively, into the p-type substrate 206. P-type regions 214A and214B, respectively, are doped into the n-type regions 208A and 208B toreduce the cross-sectional area of the resistor, thereby increasing itsrespective resistance. A first trace 218A is disposed atop a dielectriclayer 222 and routes an electric current to the first pinch resistor202A through a first contact 224A through the dielectric layer 222. Theelectric current travels through the first pinch resistor 202A andthrough a second contact 224B through the dielectric layer 222. A secondtrace 218B is disposed atop the dielectric layer 222 and is inelectrical contact with the second contact 224B. The second trace 218Broutes the electric current to the second pinch resistor 202B by a thirdcontact 224C through the dielectric layer 222. The electric currenttravels through the second pinch resistor 202B and exits through afourth contact 224D through the dielectric layer 222. A third trace 218Cis disposed atop the dielectric layer 222 and is in electrical contactwith the fourth contact 224D to route the electric current to othercomponents in the IC device.

Higher performance, lower cost, increased miniaturization of thecomponents comprising the IC devices, and greater packaging density ofIC devices are ongoing goals of the computer industry. The advantages ofincreased miniaturization of components include: reduced-bulk electronicequipment, improved reliability by reducing the number of solder or plugconnections, lower assembly and packaging costs, and improved circuitperformance. In pursuit of increased miniaturization, IC devices havebeen continually redesigned to achieve ever-higher degrees ofintegration which has reduced the size of the IC device. However, as thedimensions of the IC devices are reduced, the geometry of the componentsand circuit elements has also decreased. Moreover, as components becomesmaller and smaller, tolerances for all semiconductor structures (suchas circuitry traces, contacts, dielectric thickness, and the like)become more and more stringent. Although the reduction in size createstechnical problems, the future advancement of the technology requiressuch size reductions.

Of course, the reduction in component size and density packing (smallercomponent-to-component spacing) of the components in the IC devices hasresulted in a greatly reduced area for running traces to interconnectthe components. Furthermore, the integration and densification processin IC devices has caused the continuous migration of traces andconnections, which were previously routed on printed circuit boards,cards, and modules, to the IC device itself, yet further reducingpotential area for forming traces. Thus, multilevel metallization hasbecome a technique to cope with the reduced area. Multilevelmetallization is a technique of forming traces on different layers ofdielectric material over the components. FIG. 11 illustrates anexemplary four-tier metallization structure 240. The metallizationstructure 240 shows an active area 242 formed in a semiconductorsubstrate 244 which is in electrical communication with a first leveltrace 246A, such as aluminum, tungsten, titanium, or various alloysthereof. The first level trace 246A is disposed over a first levelbarrier layer 248A, such as a silicon nitride layer, which is over thesemiconductor substrate 244. A first level dielectric layer 252A isdisposed over the first level trace 246A and the exposed first levelbarrier layer 248A. A second level barrier layer 248B is disposed overthe first level dielectric layer 252A and a second level trace 246B isformed on the second level barrier layer 248B. The first level trace246A and the second level trace 246B are in electrical communicationthrough a first-to-second level contact 258A which extends through thefirst level dielectric layer 252A and the second level barrier layer248B.

A second level dielectric layer 252B is disposed over the second leveltrace 246B and the exposed second level barrier layer 258A. A thirdlevel barrier layer 248C is disposed over the second level dielectriclayer 252B and a third level trace 246C is formed on the third levelbarrier layer 248C. The second level trace 246B and the third leveltrace 246C are in electrical communication through a second-to-thirdlevel contact 258B which extends through the second level dielectriclayer 252B and the third level barrier layer 248C.

A third level dielectric layer 252C is disposed over the third leveltrace 246C and the exposed third level barrier layer 258B. A fourthlevel barrier layer 248D is disposed over the third level dielectriclayer 252C and a fourth level trace 246D is formed on the fourth levelbarrier layer 248D. The third level trace 246C and the fourth leveltrace 246D are in electrical communication through a third-to-fourthlevel contact 258C which extends through the third level dielectriclayer 252C and the fourth level barrier layer 248D.

A fourth level dielectric layer 252D is disposed over the fourth leveltrace 246D and the exposed fourth level barrier layer 258C. The uppersurface 284 of the fourth level dielectric layer 252D is used to formbond pads 286 in specific locations and external communication traces288 conduct input/output signals to solder balls 292. The solder balls292 will be connected to external devices, such as a printed circuitboard, to relay input/output signals therebetween.

FIG. 12 is a top view of the metallization structure 240 of FIG. 11prior to the addition of solder balls 292. As FIG. 12 illustrates, thebond pads 286 are patterned in specific locations for activesurface-down mounting to contact sites of metal conductors of a carriersubstrate (not shown), such as a printed circuit board, FR4, or thelike, wherein the contact sites are a mirror-image of the bond pads 286pattern on the metallization structure 240 . It is, of course,understood that although the bond pads 286 are illustrated assubstantially square, they can be of any shape, including round, asshown as round bond pad 294.

Although multilayer metallization is effective in compensating forreduced areas for trace patterning, the thickness of the IC device isalso a concern. Therefore, it can be appreciated that it would beadvantageous to develop a technique which would maximize the availablearea on an IC device for patterning traces for the interconnection of ICdevice components, without adding additional layers to the multilayerstructure.

BRIEF SUMMARY OF THE INVENTION

The present invention relates to the formation of routing traces on anexternal surface of a semiconductor device. In an exemplary method ofthe present invention, a flip-chip is provided which has an activesurface bearing a plurality of bonds pads upon which minute solder ballsor other conductive material elements are to be disposed. The bond padsare patterned in specific locations for active surface-down mounting tocontact sites of metal conductors of a carrier substrate, such as aprinted circuit board, wherein the contact sites are a mirror-image ofthe bond pad pattern on the flip-chip. The bond pads are in electricalcommunication with external communication traces which are used to routesignals from the flip-chip integrated circuitry. Such externalcommunication traces generally result in unused space on the exteriorsurface of the flip-chip. This unused space can be utilized for formingrouting traces for the internal circuitry of the flip-chip rather thanforming such routing traces internally.

Another embodiment of the present invention comprises using routingtraces to connect two or more substantially adjacent semiconductor dice.A first semiconductor die and a second semiconductor die are placed inone or more recesses in a semiconductor carrier. The first semiconductordie and the second semiconductor die are substantially flush with a topsurface of the semiconductor carrier. An appropriate filler material isutilized to fill any gaps between the walls of the recesses and thesemiconductor dice placed therein. The filler material may be usuallyplanarized to be substantially flush with the first and secondsemiconductor dice, and the semiconductor carrier top surface. With sucha configuration, routing traces can be patterned over the surfaces ofthe semiconductor carrier and the filler material to interconnect thefirst and second semiconductor dice.

Yet another embodiment of the present invention comprises using routingtraces as repair mechanisms. A series of routing traces can be used asdeactivation mechanisms on a semiconductor device. When a defectiveportion of a semiconductor device is detected during a testingprocedure, a routing trace can be physically severed to deactivate thedefective portion. With some applications, the deactivation will resultin the activation of a redundant circuit to take over for the defectivecircuit. In other applications, the deactivation of a defective portionof a semiconductor device will simply deactivate the defective portionof the semiconductor device.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

While the specification concludes with claims particularly pointing outand distinctly claiming that which is regarded as the present invention,the advantages of this invention can be more readily ascertained fromthe following description of the invention when read in conjunction withthe accompanying drawings in which:

FIG. 1 is a top plan view of an active surface of a prior art flip-chip;

FIG. 2 is a side cross-sectional view of the prior art flip-chip alongline 2—2 of FIG. 1;

FIG. 3 is a top plan view of a flip-chip which has its active surfaceutilized as an addition layer for routing traces for the circuitrywithin the flip-chip according to the present invention;

FIGS. 4a and 4 b are side cross-sectional views of two embodiments ofrouting traces along line 4—4 in FIG. 3 according to the presentinvention;

FIG. 5 is a top plan view of two flip-chips interconnected with routingtraces according to the present invention;

FIG. 6 is a side cross-sectional view of a routing trace along line 6—6of FIG. 5 according to the present invention;

FIG. 7 is a top plan view of two flip-chips interconnected with routingtraces according to the present invention;

FIG. 8 is a side cross-sectional view of a routing trace along line 8—8of FIG. 7 according to the present invention;

FIG. 9 is a top plan view of routing traces utilized as deactivationmechanisms according to the present invention;

FIG. 10 is a side cross-sectional view of a prior art pinched resistorpair;

FIG. 11 is a side cross-sectional view of a prior art metallizationstructure; and

FIG. 12 is a top plan view of the prior art metallization structure ofFIG. 10.

DETAILED DESCRIPTION OF THE INVENTION

FIGS. 1-9 illustrate various trace configurations on a contact surfaceof a semiconductor device according to the present invention. It shouldbe understood that the illustrations are not meant to be actual views ofany particular semiconductor IC device, but are merely idealizedrepresentations which are employed to more clearly and fully depict thepresent invention than would otherwise be possible. Additionally,elements and features common to FIGS. 1-9 retain the same numericaldesignation.

FIG. 1 shows a top plan view of an active surface 102 for a flip-chip100. The active surface 102 includes a plurality of ball or bump sites104 upon which minute solder balls or other conductive material elements(not shown) are to be disposed. The ball or bump sites 104 are patternedin specific locations for active surface-down mounting to contact sitesof metal conductors of a carrier substrate (not shown), such as aprinted circuit board, wherein the contact sites are a mirror-image ofthe ball or bump sites 104 pattern on the flip-chip 100. The ball orbump sites 104 are in electrical communication with externalcommunication traces 106 which are used to route power to and signals toand from the flip-chip 100 integrated circuitry (not shown—i.e., belowthe active surface 102). It is, of course, understood that although theball or bump sites 104 are illustrated as substantially square, they maybe of any shape, including round, as shown as round ball site 108.

FIG. 2 shows a side cross-sectional view along line 2—2 of FIG. 1 whichshows a contact 112 making an electrical connection between the externalcommunication trace 106 and an internal trace 114 within the flip-chip100. Although FIG. 1 shows all of the external communication traces 106routing from contacts 112 (see FIG. 2) which are about peripheral edges116 of the flip-chip 100, it is understood that each contact 112 (seeFIG. 2) could be positioned anywhere to extend through to the activesurface 102 of the flip-chip 100.

Referring again to FIG. 1, it can be seen that a majority of the area ofthe active surface 102 is not used in positioning the ball or bump sites104 with the external communication traces 106. Thus, these unused areasare utilized as an additional surface for routing traces for thecircuitry within the flip-chip 100. FIG. 3 illustrates three suchrouting traces: a first routing trace 122, a second routing trace 124,and a third routing trace 126. It is, of course, understood that therouting trace (e.g., 122, 124, and 126) can be considerably smaller(thinner in width and/or height) than the external communication traces106, since the routing traces generally require substantially lesscurrent than the external communication traces 106. Externalcommunication traces 106 route power to and signals to and from anexternal device (not shown) which, for output signals, requiresamplifying the original signal within the semiconductor device to asufficiently strong signal for external communication. The ball or bumpsites 104, the external communication traces 106, and the routing traces122, 124, and 126 may be formed in separate steps or simultaneouslyformed by various methods, including, but not limited to:

1) Coating the semiconductor die active surface 102 with a metal, suchas aluminum, copper, gold, silver, and alloys thereof, forming a maskwith a photoresist by exposing the photoresist to react it in a specificpattern, washing the unreacted photoresist off of the semiconductor dieactive surface, and etching the metal through the photoresist, therebyforming the ball or bump sites 104, the external communication traces106, and the routing traces 122, 124, and 126;

2) Coating the semiconductor die active surface 102 with a conductivephotopolymer, exposing the photopolymer to react it in a specificpattern, and washing the unreacted photopolymer, thereby forming theball or bump sites 104, the external communication traces 106, and therouting traces 122, 124, and 126; and

3) Screen printing conductive or conductor-carrying polymer on thesemiconductor die active surface 102, thereby forming the ball or bumpsites 104, the external communication traces 106, and the routing traces122, 124, and 126.

The first routing trace 122 is an example of a short “jumping” trace.Referring to FIGS. 4A-4B, the path for connecting first internal trace132A with second internal trace 132C is blocked by a lateral trace 132Bwhich is running perpendicular to the plane of the cross-section on afourth level 138 of the multilevel structure of the flip-chip 100. Afirst internal trace-to-first trace contact 142A is formed to connectthe first internal trace 132A with the first routing trace 122 and afirst trace-to-second internal trace contact 142B is formed to connectthe first routing trace 122 with the second internal trace 132C, thereby“jumping” the lateral trace 132B.

The second routing trace 124 (FIG. 3) extends substantially the lengthof the flip-chip 100. Such a routing trace is very advantageous forcomponents in electrical communication with one another, but which arewidely spaced from one another. If such a routing trace were notavailable, the components could be connected internally, which wouldlikely require a lengthy, serpentine route shifting from layer to layerin the multilayer structure of the flip-chip 100. The direct route ofthe second routing trace 124 greatly reduces the overall length of thetrace, thereby decreasing the time required for signals to travelbetween the components, and reduces the capacitance due to a reductionof the amount of metal required. The third routing trace 126 illustratesthat the routing traces can be patterned to “snake” around the ball orbump sites 104 and external communication traces 106.

Another embodiment of the present invention comprises using routingtraces to connect two or more semiconductor dice, as illustrated inFIGS. 5 and 6. FIG. 5 illustrates a first semiconductor die 152 and asecond semiconductor die 152B placed in separate recesses in asemiconductor carrier 156. The semiconductor carrier 156 can be made ofsilicon, ceramic material, or even metal with a surface of insulativematerial etched to form recesses having sloped walls. However, thesemiconductor carrier 156 should have a coefficient of thermal expansion(CTE) which is similar to the CTE of the semiconductor dice and filler,so that the heat expansion and contraction does not break the routingtraces.

As shown in FIG. 6 (a cross-sectional view of FIG. 5 along line 6—6),the first semiconductor die 152 and the second semiconductor die 152Bare substantially flush with a top surface 160 of the semiconductorcarrier 156. An appropriate filler material 158, such as “filled”epoxies or silicones, is utilized to fill any gaps in the recess. Thefiller material 158 is preferably planarized to be substantially flushwith the first and second semiconductor dice 152 and 152B, and thesemiconductor carrier top surface 160. However, if the filler material158 is planarized, the ball or bump sites, the external communicationtraces, and the routing traces must be formed thereafter. With such aconfiguration, routing traces 162 can be patterned to interconnect thefirst and second semiconductor dice 152 and 152B.

Yet another embodiment of the present invention comprises using routingtraces to connect two or more semiconductor dice, as illustrated inFIGS. 7 and 8. FIG. 7 illustrates the first semiconductor die 152 and asecond semiconductor die 154 placed in a Single recess in asemiconductor carrier 156, wherein the first semiconductor die 152 andthe second semiconductor die 154 abut one another. As shown in FIG. 8 (across-sectional view of FIG. 7 along line 8—8), the first semiconductordie 152A and the second semiconductor die 152B are substantially flushwith a top surface 160 of the semiconductor carrier 156. An appropriatefiller material 158 is utilized to fill any gaps in the recess. Thefiller material 158 Is usually planarized to be substantially flush withthe first and second semiconductor dice 152A and 152B, and thesemiconductor carrier top surface 160. With such a configuration,routing traces 162 can be patterned to interconnect the first and secondsemiconductor dice 152A and 152B. An insulative spacer (not shown) maybe disposed between the first and second semiconductor dice 152A and152B to prevent shorting therebetween.

The embodiments illustrated in FIGS. 5-8 considerably simplifyinter-semiconductor dice communication. Previously, ifinter-semiconductor dice communication was required, a signal from thefirst semiconductor die would have to be amplified and sent from aninterconnection out of the first semiconductor die and through aexternal communication trace to a bond pad. The bond pad would beconnected to a carrier substrate, such as a printed circuit board, FR4,or the like, with a solder ball, conductive epoxy pillar, or the like.The carrier substrate would, in turn, route the signal through a traceto a solder ball connected to a bond pad on a second semiconductordevice. The signal would then be directed by an external communicationtrace to an interconnection into the second semiconductor device. Thisembodiment reduces or may eliminate any requirement for signalamplification and the necessity of using the valuable space which wouldbe required by the additional external communication traces and bondpads on both the first and second semiconductor dice, as well as theadditional trace on the external carrier substrate. Furthermore, thisembodiment allows for faster transmission of signals between the twosemiconductor dice and reduces capacitance by reducing the amount ofmetal required to form the connections. This embodiment also eliminatesthe use of an interposer board with yet another set of solder balls to ahigher level carrier.

Yet another embodiment of the present invention comprises using routingtraces as repair mechanisms. As shown in FIG. 9, a series of traces 172a-d can be used as deactivation mechanisms on a semiconductor device170. When a defective portion of a semiconductor device is detectedduring a testing procedure, a trace (shown as trace 172 d) can bephysically severed to deactivation the defective portion. With someapplications, this deactivation will result in the activation of aredundant circuit to take over for the defective circuit. In otherapplications, this deactivation of a defective portion of asemiconductor device will simply deactivate the defective portion of thesemiconductor device. For example, in a memory chip, this deactivationwill result in isolation of defective storage capacity on the memorychip.

Prior art fuses are programming devices which are blown by a tester toisolate area on a chip. However, blowing these fuses can cause damage tothe chip. The repair mechanisms shown in FIG. 9 function to isolate ashort or a latched-up area without risking damage to the chip.

Having thus described in detail preferred embodiments of the presentinvention, it is to be understood that the invention defined by theappended claims is not to be limited by particular details set forth inthe above description as many apparent variations thereof are possiblewithout departing from the spirit or scope thereof.

What is claimed is:
 1. A flip-chip, comprising: a semiconductor chipincluding at least one active surface having internal circuitrythereunder; a plurality of spaced apart bump sites over said at leastone active surface for directing signals between said internal circuitryof said semiconductor chip and at least one other component external tosaid semiconductor chip; at least one routing trace carried over an areaof said at least one active surface unoccupied by said bump sites toconnect a first internal circuit component to a second internal circuitcomponent of said semiconductor chip; and electrically conductive bumpson at least some of said plurality of spaced apart bump sites.
 2. Theflip-chip of claim 1, wherein said area of said at least one activesurface unoccupied by said bump sites extends substantially an entirelength of said semiconductor chip.
 3. The flip-chip of claim 1, whereinat least one of said at least one routing trace is configured tointerconnect at least two otherwise electrically isolated internalcircuitry components of said semiconductor chip.
 4. The flip-chip ofclaim 1, wherein at least one of said at least one routing trace is acomponent of a first circuit of said internal circuitry, and whereinsaid first circuit is redundant with at least one second circuit of saidinternal circuitry.
 5. The flip-chip of claim 1, wherein saidsemiconductor chip is configured as a memory chip.
 6. The flip-chip ofclaim 3, wherein said at least two otherwise electrically isolatedinternal circuitry components lie substantially within a same plane, andfurther comprising a third internal circuit component disposed betweensaid at least two otherwise electrically isolated internal circuitrycomponents.
 7. The flip-chip of claim 4, wherein said at least onesecond circuit of said internal circuitry is configured to be activatedwhen said at least one of said at least one routing trace is severed. 8.The flip-chip of claim 4, wherein said at least one second circuit ofsaid internal circuitry is configured to be deactivated when said atleast one of said at least one routing trace is severed.
 9. A flip-chip,comprising: a semiconductor chip including at least one active surfacehaving internal circuitry thereunder; a plurality of spaced apart bumpsites over said at least one active surface for directing signalsbetween said internal circuitry of said semiconductor chip and at leastone other component external to said semiconductor chip; at least onerouting trace carried over an area of said at least one active surfaceunoccupied by said bump sites, said at least one routing tracecomprising a repair mechanism; and electrically conductive bumps on atleast some of said plurality of spaced apart bump sites.
 10. Theflip-chip of claim 9, wherein said repair mechanism is configured to beoperable by severance of said at least one routing trace to activate aselected internal circuit in said semiconductor chip.
 11. The flip-chipof claim 9, wherein said repair mechanism is configured to be operableby severance of said at least one routing trace to deactivate a selectedinternal circuit in said semiconductor chip.
 12. The flip-chip of claim9, wherein said semiconductor chip is configured as a memory chip. 13.The flip-chip of claim 10, wherein said at least one routing trace is acomponent of a first circuit of said internal circuitry, and whereinsaid first circuit is redundant with said selected internal circuit. 14.The flip-chip of claim 11, wherein said at least one routing trace is acomponent of a first circuit of said internal circuitry, and whereinsaid first circuit is redundant with said selected internal circuit. 15.A flip-chip, comprising: a semiconductor chip including at least oneactive surface having internal circuitry thereunder; a plurality ofspaced apart bump sites over said at least one active surface fordirecting signals between said internal circuitry of said semiconductorchip and at least one other component external to said semiconductorchip; at least one routing trace carried over an area of said at leastone active surface and lying within a same plane as said bump sites andlaterally spaced therefrom, said at least one routing trace connecting afirst internal circuit component to a second internal circuit componentof said semiconductor chip; and electrically conductive bumps on atleast some of said plurality of spaced apart bump sites.
 16. Theflip-chip of claim 15, wherein said area of said at least one activesurface lying within the same plane as said plurality of spaced apartbump sites extends substantially an entire length of said semiconductorchip.
 17. The flip-chip of claim 15, wherein at least one of said atleast one routing trace is configured to interconnect at least twootherwise electrically isolated internal circuitry components of saidsemiconductor chip.
 18. The flip-chip of claim 15, wherein said at leastone routing trace is configured as a repair mechanism, said repairmechanism adapted to be operable by severance of said at least onerouting trace to activate a selected internal circuit in saidsemiconductor chip.
 19. The flip-chip of claim 15, wherein said at leastone routing trace is configured to be a repair mechanism, said repairmechanism adapted to be operable by severance of said at least onerouting trace to deactivate a selected internal circuit in saidsemiconductor chip.
 20. The flip-chip of claim 17, wherein said at leasttwo otherwise electrically isolated internal circuitry components liesubstantially within the same plane, and further comprising a thirdinternal circuit component disposed between said at least two otherwiseelectrically isolated internal circuitry components.
 21. A semiconductordevice, comprising: a plurality of semiconductor chips each having atleast one active surface; a plurality of spaced apart bump sites oversaid at least one active surface of each semiconductor chip of saidplurality for directing signals between internal circuitry of arespective said semiconductor chip and at least one other externalcomponent; at least one routing trace on an area of said at least oneactive surface unoccupied by said bump sites of one of said plurality ofsemiconductor chips and extending to said area of said at least oneactive surface unoccupied by said bump sites of another of saidplurality of semiconductor chips to effect an electrical connectionbetween at least one internal circuit component of said one of saidplurality of semiconductor chips and said at least one internal circuitcomponent of said another of said plurality of semiconductor chips. 22.The semiconductor device of claim 21, further including: a carrierhaving a surface with at least one recess therein to receive saidplurality of semiconductor chips, wherein said at least one recessallows substantial alignment of said surface of said carrier with saidat least one active surface of said plurality of semiconductor chips.23. The semiconductor device of claim 22, further including: a fillermaterial disposed in gaps between walls of each of said at least onerecess and each of said plurality of semiconductor chips disposedtherein.
 24. The semiconductor device of claim 22, wherein said carrierincludes a plurality of recesses.
 25. A semiconductor device,comprising: a semiconductor chip having at least one active surface; aplurality of spaced apart bump sites on said at least one active surfaceof said semiconductor chip for directing signals between internalcircuitry of said semiconductor chip and at least one externalcomponent; at least one routing trace, extending between two circuitportions of said semiconductor chip, on an area of said at least oneactive surface unoccupied by said bump sites, wherein said at least onerouting trace comprises a repair mechanism.
 26. The semiconductor deviceof claim 25, wherein said repair mechanism is configured to be operableby severance of said at least one routing trace to activate a selectedinternal circuit in said semiconductor chip.
 27. The semiconductordevice of claim 25, wherein said repair mechanism is configured to beoperable by severance of said at least one routing trace to deactivate aselected internal circuit in said semiconductor chip.
 28. Asemiconductor device, comprising: a semiconductor chip having at leastone active surface; a plurality of spaced apart bump sites within a sameplane over said at least one active surface of said semiconductor chip,wherein each of said bump sites is adapted to direct signals betweeninternal circuitry of said semiconductor chip and at least one externalcomponent; and at least one routing trace carried over an area of saidat least one active surface and lying within the same plane as said bumpsites and laterally spaced therefrom, said at least one routing traceconnecting a first internal circuit component to a second internalcircuit component of said semiconductor chip.
 29. A semiconductordevice, comprising: a semiconductor chip having at least one activesurface; a plurality of spaced apart bump sites over said at least oneactive surface of said semiconductor chip, wherein each of said bumpsites is adapted to direct signals between internal circuitry of saidsemiconductor chip and at least one external component; and at least onerouting trace carried over said at least one active surface in an areaunoccupied by said bump sites, said at least one routing traceconnecting a first internal circuit component to a second internalcircuit component of said semiconductor chip.
 30. A semiconductordevice, comprising: a semiconductor chip having at least one activesurface; a plurality of spaced apart bump sites over said at least oneactive surface of said semiconductor chip, wherein each of said bumpsites is adapted to direct signals between internal circuitry of saidsemiconductor chip and at least one external component; and at least onerouting trace carried over an area of said at least one active surfacein laterally spaced relationship to said bump sites, said at least onerouting trace connecting a first internal circuit component to a secondinternal circuit component of said semiconductor chip.